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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0741-04-G2C-1-A | 1.0000 |  |
1197 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-G2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K410T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0712-02-82C36-A | - | |
6403 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-82C36-A | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0803-02-02EG-1EA | - | |
5048 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-02EG-1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
 |
TE0726-03RJ | - | |
2685 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Obsolete | 0°C ~ 70°C | 1.180" L x 1.570" W (30.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0726-03RJ | OBSOLETE | 1 | ARM Cortex-A9 | - | 128MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | CSI, DSI | ||||
|
TEC0850-03-15EG1E | - | |
3881 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Obsolete | - | - | TEC0850 | download | Not Applicable | 1686-1163 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU15EG-1FFVB1156E | - | 8GB | 128MB | MCU, FPGA | - | CompactPCI Serial Backplane | |||
|
TE0803-04-4AE11-A | 518.7000 | |
6135 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4AE11-A | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0723-03-41C64-A | 161.7000 | |
7809 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0723-03-41C64-A | 1 | ||||||||||||||
 |
TE0713-01-200-2C | - | |
2458 | 0.00000000 | Trenz Electronic GmbH | TE0713 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | 1686-1144 | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||||
 |
TE0745-02-45-2I | - | |
3936 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec UFPS | |||||
|
TE0808-05-BBE21-AZ | 361.2000 | |
4913 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1 | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||||
|
TE0630-02IBF | 303.4500 | |
5125 | 0.00000000 | Trenz Electronic GmbH | TE0630 | Bulk | Active | -40°C ~ 85°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | TE0630 | - | ROHS3 Compliant | Not Applicable | 0000.00.0000 | 1 | Spartan-6 LX-75 | 100MHz | 128MB | 8MB | FPGA, USB Core | Cypress EZ-USB FX2LP | B2B | ||||
|
TE0841-02-41I21-A | 2.0000 | |
3256 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0841 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0841-02-41I21-A | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU40 | - | 2GB | 64MB | MCU, FPGA | - | B2B | ||
 |
TE0600-03-52I11-C | - | |
8935 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03-52I11-C | 1 | Spartan-6 LX-45 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||||
|
TE0720-04-61Q33ML | 340.2000 | |
4514 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61Q33ML | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0712-02-72C06-M | - | |
4158 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-72C06-M | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
 |
TE0820-03-04CG-1EA | - | |
7494 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | download | Not Applicable | 1686-1160 | 5A002A1 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0714-02-35-2I | - | |
8915 | 0.00000000 | Trenz Electronic GmbH | TE0714 | Bulk | Obsolete | -40°C ~ 85°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | download | 1 (Unlimited) | REACH Unaffected | 1686-1031 | 3A991D | 8471.50.0150 | 1 | Artix-7 A35T | - | 16MB | FPGA Core | - | Samtec LSHM | ||||
 |
TE0745-02-30-1IA | - | |
4168 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | 1686-1108 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec UFPS | |||||
|
TE0803-04-5DI21-A | 1.0000 | |
7358 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-5DI21-A | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784I | - | 4GB | 128MB | MPU Core | - | B2B | |||||
 |
TE0782-02-045-2I | - | |
4813 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Obsolete | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | TE0782 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec QTH | ||||
 |
TE0712-02-35-2I | - | |
1677 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0712 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A35T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||
 |
TE0723-03M | - | |
3396 | 0.00000000 | Trenz Electronic GmbH | TE0723 | Box | Obsolete | 0°C ~ 70°C | TE0723 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1066 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 12MHz | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | B2B | ||
|
TE0745-02-30-1IA-K | - | |
2648 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-30-1IA-K | OBSOLETE | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec ST5 | ||||
|
TE0813-01-4DE11-AZ | 614.0800 | |
1091 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-4DE11-AZ | 1 | ||||||||||||||
 |
TE0745-01-45-2I | - | |
1818 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec UFPS | |||||
|
S00021-02 | - | |
8204 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-S00021-02 | 1 | ||||||||||||||
|
TE0807-03-4BE21-A | 1.0000 | |
3404 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-4BE21-A | 1 | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
 |
TE0715-05-51I33-A | 387.4500 | |
3 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-51I33-A | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | |||||
|
TE0821-01-3BE21ML | 521.0000 | |
1018 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-3BE21ML | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||||
|
TE0720-03-1QFA | - | |
2680 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-1QFA | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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