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Image | Numéro de Produit | Prix (USD) | Quantité | ECAD | Quantité disponible | Poids (kg) | MFR | Série | Peigner | ÉTAT DU PRODUIT | Température de fonctionnels | Type de Montage | Package / ÉTUI | Technologie | Tension - alimentation | Forfait de Périphérique Fournisseur | Fiche de Donnés | Noms Autres | HTSUS | Norme de package | Fréquence d'Horloge | Type de Mémoire | Taille de la Mémoire | Heure d'accès | Format de Mémoire | Organisation de Mémoire | Interface de Mémoire | Écrivez le Temps du Cycle - Mot, Page |
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![]() | Gd25d10ttegr | 0 2929 | ![]() | 6968 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | Gd25d | Ruban Adhésif (tr) | Actif | -40 ° C ~ 125 ° C (TA) | Support de surface | 8-SOIC (0,154 ", 3,90 mm de grandeur) | Flash - Ni (SLC) | 2,7 V ~ 3,6 V | 8-SOP | télécharger | 1970-GD25D10CTEGRTR | 3 000 | 100 MHz | Non volatile | 1mbit | 6 ns | Éclair | 128k x 8 | Spi - double e / s | 80 µs, 4 ms | ||
![]() | Gd25wd40etigr | 0,3167 | ![]() | 8823 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | Gd25wd | Ruban Adhésif (tr) | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | 8-SOIC (0,154 ", 3,90 mm de grandeur) | Flash - Ni (SLC) | 1,65 V ~ 3,6 V | 8-SOP | télécharger | 1970-gd25wd40etigrtr | 3 000 | 104 MHz | Non volatile | 4mbbitons | 6 ns | Éclair | 512k x 8 | Spi - double e / s | 100 µs, 6 ms | ||
![]() | Gd5f1gq5wigr | 2.4851 | ![]() | 5290 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | Gd5f | Ruban Adhésif (tr) | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Nand (SLC) | 1,7 V ~ 2V | 8-WSON (5x6) | télécharger | 1970-gd5f1gq5wigrtr | 3 000 | 104 MHz | Non volatile | 1 gbit | 9,5 ns | Éclair | 256m x 4 | Spi - quad e / o, qpi, dtr | 600 µs | ||
![]() | Gd25q16tegr | 0,6552 | ![]() | 3651 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25Q | Ruban Adhésif (tr) | Actif | -40 ° C ~ 125 ° C (TA) | Support de surface | 8-SOIC (0,154 ", 3,90 mm de grandeur) | Flash - Ni (SLC) | 2,7 V ~ 3,6 V | 8-SOP | télécharger | 1970-GD25Q16ETEGRTR | 3 000 | 133 MHz | Non volatile | 16mbitons | 7 ns | Éclair | 2m x 8 | Spi - quad e / o | 140 µs, 4 ms | ||
![]() | Gd25lq64enagr | 1 5582 | ![]() | 5729 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25LQ | Ruban Adhésif (tr) | Actif | -40 ° C ~ 125 ° C (TA) | Support de surface | Pad Exposé 8-UDFN | Flash - Ni (SLC) | 1,65 V ~ 2V | 8-USON (3x4) | - | 1970-GD25LQ64Enagrtr | 3 000 | 133 MHz | Non volatile | 64mbitons | 6 ns | Éclair | 8m x 8 | Spi - quad e / o, qpi | 100 µs, 4 ms | ||
![]() | Gd55le511meyigy | 4.3092 | ![]() | 8110 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | - | Plateau | Actif | - | 1970-gd55le511meyigy | 4 800 | ||||||||||||||||
![]() | Gd25ld20ekigr | 0,3167 | ![]() | 4484 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | Gd25ld | Ruban Adhésif (tr) | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | Pad Exposé 8-XFDFN | Flash - Ni (SLC) | 1,65 V ~ 2V | 8-USON (1,5x1,5) | télécharger | 1970-GD25LD20EKIGRTR | 3 000 | 50 MHz | Non volatile | 2mbitons | 12 ns | Éclair | 256k x 8 | Spi - double e / s | 100 µs, 6 ms | ||
![]() | Gd55b01gebiry | 8.4011 | ![]() | 3284 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD55B | Plateau | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | 24 TBGA | Flash - Ni (SLC) | 2,7 V ~ 3,6 V | 24-TFBGA (6x8) | télécharger | 1970-GD55B01GEBIRY | 8542.32.0071 | 4 800 | 133 MHz | Non volatile | 1 gbit | Éclair | 128m x 8 | Spi - quad e / o, qpi, dtr | - | ||
![]() | Gd25b512mebjry | 5.2136 | ![]() | 4467 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25B | Plateau | Actif | -40 ° C ~ 105 ° C (TA) | Support de surface | 24 TBGA | Flash - Ni (SLC) | 2,7 V ~ 3,6 V | 24-TFBGA (6x8) | télécharger | 1970-GD25B512Mebjry | 4 800 | 133 MHz | Non volatile | 512mbitons | Éclair | 64m x 8 | Spi - quad e / o, qpi, dtr | - | |||
![]() | Gd25q80etegr | 0 4525 | ![]() | 2591 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25Q | Ruban Adhésif (tr) | Actif | -40 ° C ~ 125 ° C (TA) | Support de surface | 8-SOIC (0,154 ", 3,90 mm de grandeur) | Flash - Ni (SLC) | 2,7 V ~ 3,6 V | 8-SOP | télécharger | 1970-GD25Q80ETEGRTR | 3 000 | 133 MHz | Non volatile | 8mbitons | 7 ns | Éclair | 1m x 8 | Spi - quad e / o | 140 µs, 4 ms | ||
![]() | Gd55wb512meyigy | 4.6816 | ![]() | 4786 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | Gd55wb | Plateau | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Ni (SLC) | 1,65 V ~ 3,6 V | 8-WSON (6x8) | - | 1970-gd55wb512meyigy | 4 800 | 104 MHz | Non volatile | 512mbitons | Éclair | 64m x 8 | Spi - quad e / o | - | |||
![]() | Gd25lq64ewagr | 1.6045 | ![]() | 6739 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25LQ | Ruban Adhésif (tr) | Actif | -40 ° C ~ 125 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Ni (SLC) | 1,65 V ~ 2V | 8-WSON (5x6) | - | 1970-GD25LQ64EWAGRTR | 3 000 | 133 MHz | Non volatile | 64mbitons | 6 ns | Éclair | 8m x 8 | Spi - quad e / o, qpi | 100 µs, 4 ms | ||
![]() | Gd25d80ctigr | 0,2783 | ![]() | 2411 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | Gd25d | Ruban Adhésif (tr) | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | 8-SOIC (0,154 ", 3,90 mm de grandeur) | Flash - Ni (SLC) | 2,7 V ~ 3,6 V | 8-SOP | télécharger | 1970-gd25d80ctigrtr | 3 000 | 100 MHz | Non volatile | 8mbitons | 6 ns | Éclair | 1m x 8 | Spi - double e / s | 50 µs, 4 ms | ||
![]() | Gd5f2gm7ueyigy | 3.2825 | ![]() | 6646 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | Gd5f | Plateau | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Nand (SLC) | 2,7 V ~ 3,6 V | 8-WSON (6x8) | télécharger | 1970-gd5f2gm7ueyigy | 4 800 | 133 MHz | Non volatile | 2 gbit | 7 ns | Éclair | 256m x 8 | Spi - quad e / o, dtr | 600 µs | ||
![]() | GD25Q256EWIGY | 2.2897 | ![]() | 7620 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25Q | Plateau | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Ni (SLC) | 2,7 V ~ 3,6 V | 8-WSON (5x6) | télécharger | 1970-GD25Q256EWIGY | 5 700 | 133 MHz | Non volatile | 256mbitons | Éclair | 32m x 8 | Spi - quad e / o | - | |||
![]() | GD25LT512MEFIRY | 5.7957 | ![]() | 6463 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | Gd25lt | Plateau | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | 16-SOIC (0,295 ", 7,50 mm de grandeur) | Flash - Ni (SLC) | 1,65 V ~ 2V | 16-SOP | - | 1970-GD25LT512MEFIRY | 1 760 | 200 MHz | Non volatile | 512mbitons | Éclair | 64m x 8 | Spi - quad e / o, qpi, dtr | - | |||
![]() | Gd25q64cw2gr | 1.3970 | ![]() | 9623 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25Q | Ruban Adhésif (tr) | Actif | -40 ° C ~ 105 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Ni (SLC) | 2,7 V ~ 3,6 V | 8-WSON (5x6) | - | 1970-GD25Q64CW2grtr | 3 000 | 120 MHz | Non volatile | 64mbitons | 7 ns | Éclair | 8m x 8 | Spi - quad e / o | 60 µs, 4 ms | ||
![]() | Gd5f1gq5ueyigy | 2.3296 | ![]() | 8895 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | Gd5f | Plateau | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Nand (SLC) | 2,7 V ~ 3,6 V | 8-WSON (6x8) | télécharger | 1970-gd5f1gq5ueyigy | 4 800 | 133 MHz | Non volatile | 1 gbit | 7 ns | Éclair | 256m x 4 | Spi - quad e / o, qpi, dtr | 600 µs | ||
![]() | Gd25q64esjgr | 0,8705 | ![]() | 3820 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25Q | Ruban Adhésif (tr) | Actif | -40 ° C ~ 105 ° C (TA) | Support de surface | 8-SOIC (0,209 ", 5,30 mm de grandeur) | Flash - Ni (SLC) | 2,7 V ~ 3,6 V | 8-SOP | télécharger | 1970-GD25Q64ESJGRTR | 2 000 | 133 MHz | Non volatile | 64mbitons | 7 ns | Éclair | 8m x 8 | Spi - quad e / o | 140 µs, 4 ms | ||
![]() | Gd55b01geyigy | 8.8738 | ![]() | 4263 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD55B | Plateau | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Ni (SLC) | 2,7 V ~ 3,6 V | 8-WSON (6x8) | - | 1970-gd55b01geyigy | 4 800 | 133 MHz | Non volatile | 1 gbit | Éclair | 128m x 8 | Spi - quad e / o, qpi, dtr | - | |||
![]() | GD25LB64EWIGR | 0,9126 | ![]() | 8288 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25lb | Ruban Adhésif (tr) | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Ni (SLC) | 1,65 V ~ 2V | 8-WSON (5x6) | télécharger | 1970-GD25LB64EWIGRTR | 3 000 | 133 MHz | Non volatile | 64mbitons | 6 ns | Éclair | 8m x 8 | Spi - quad e / o, qpi | 60 µs, 2,4 ms | ||
![]() | Gd25lq80cn2gr | 0,6818 | ![]() | 5726 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25LQ | Ruban Adhésif (tr) | Actif | -40 ° C ~ 105 ° C (TA) | Support de surface | Pad Exposé 8-UDFN | Flash - Ni (SLC) | 1,65 V ~ 2,1 V | 8-USON (3x4) | - | 1970-GD25LQ80CN2grtr | 3 000 | 90 MHz | Non volatile | 8mbitons | 6 ns | Éclair | 1m x 8 | Spi - quad e / o | 80 µs, 3ms | ||
![]() | Gd25lq16enigr | 0,5939 | ![]() | 6464 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25LQ | Ruban Adhésif (tr) | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | Pad Exposé 8-UDFN | Flash - Ni (SLC) | 1,65 V ~ 2,1 V | 8-USON (3x4) | télécharger | 1970-GD25LQ16ENIGRTR | 3 000 | 133 MHz | Non volatile | 16mbitons | 6 ns | Éclair | 2m x 8 | Spi - quad e / o, qpi | 60 µs, 2,4 ms | ||
![]() | GD25LQ16EWIGR | 0,6115 | ![]() | 2626 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25LQ | Ruban Adhésif (tr) | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Ni (SLC) | 1,65 V ~ 2,1 V | 8-WSON (5x6) | télécharger | 1970-GD25LQ16EWIGRTR | 3 000 | 133 MHz | Non volatile | 16mbitons | 6 ns | Éclair | 2m x 8 | Spi - quad e / o, qpi | 60 µs, 2,4 ms | ||
![]() | Gd25lt256ey2gy | 4.7723 | ![]() | 2063 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | Gd25lt | Plateau | Actif | -40 ° C ~ 105 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Ni (SLC) | 1,65 V ~ 2V | 8-WSON (6x8) | - | 1970-GD25LT256EY2GY | 4 800 | 200 MHz | Non volatile | 256mbitons | 6 ns | Éclair | 32m x 8 | Spi - quad e / o, qpi, dtr | 140 µs, 2 ms | ||
![]() | Gd9fu4g8f3amgi | 7.0543 | ![]() | 4103 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | Gd9f | Plateau | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | 48-TFSOP (0,724 ", 18,40 mm de grand) | Flash - Nand (SLC) | 2,7 V ~ 3,6 V | 48-tsop i | télécharger | 1970-gd9fu4g8f3amgi | 960 | Non volatile | 4 Gbit | 18 ns | Éclair | 512m x 8 | Onfi | 20ns | |||
![]() | Gd5f2gq5ueyihy | 3.9235 | ![]() | 4314 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | Gd5f | Plateau | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Nand (SLC) | 2,7 V ~ 3,6 V | 8-WSON (6x8) | - | 1970-gd5f2gq5ueyihy | 4 800 | 104 MHz | Non volatile | 2 gbit | 9 ns | Éclair | 512m x 4 | Spi - quad e / o, qpi, dtr | 600 µs | ||
![]() | GD55LT01GEB2RY | 16.0875 | ![]() | 1948 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD55LT | Plateau | Actif | -40 ° C ~ 105 ° C (TA) | Support de surface | 24 TBGA | Flash - Ni (SLC) | 1,65 V ~ 2V | 24-TFBGA (6x8) | - | 1970-GD55LT01GEB2RY | 4 800 | Non volatile | 1 gbit | Éclair | 128m x 8 | Spi - quad e / o, qpi, dtr | - | ||||
![]() | Gd25b32cs2gr | 0,9688 | ![]() | 7690 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25B | Ruban Adhésif (tr) | Actif | -40 ° C ~ 105 ° C (TA) | Support de surface | 8-SOIC (0,209 ", 5,30 mm de grandeur) | Flash - Ni (SLC) | 2,7 V ~ 3,6 V | 8-SOP | - | 1970-GD25B32CS2GRTR | 2 000 | 80 MHz | Non volatile | 32mbitons | 7 ns | Éclair | 4m x 8 | Spi - quad e / o | 60 µs, 4 ms | ||
![]() | GD25LQ255EWIGY | 2.1965 | ![]() | 8546 | 0,00000000 | Gigadevice Semiconductor (HK) Limited | GD25LQ | Plateau | Actif | -40 ° C ~ 85 ° C (TA) | Support de surface | Pad Exposé 8-WDFN | Flash - Ni (SLC) | 1,65 V ~ 2V | 8-WSON (5x6) | télécharger | 1970-GD25LQ255EWIGY | 5 700 | 133 MHz | Non volatile | 256mbitons | Éclair | 32m x 8 | Spi - quad e / o, qpi | - |
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