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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
T0051404399 | 20.0000 |  |
1982 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051404399 | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | Spool, 3.53 oz (100g) | 0.031" (0.79mm) | - | No-Clean | - | Lead Free | |||||
 |
SMD2024-25000 | 27.9900 | |
10 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.012" (0.31mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||
 |
27-7068-0060 | 2.0000 | |
2266 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 27-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 36 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 18 lbs (8.16kg) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | |||||
 |
ICB97110 | 7.6247 | |
2287 | 0.00000000 | Pimoroni Ltd | - | Bulk | Active | Solder Paste | - | - | - | download | Not Applicable | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Tube | - | 284°F (140°C) | No-Clean | - | Lead Free | - | ||||||||
|
CB4460400050 | 24.5890 | |
7975 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-CB4460400050 | 1 | ||||||||||||||||||||||
|
44-7317-0000 | 70.1868 | |
3211 | 0.00000000 | Kester Solder | - | Bulk | Active | Bar Solder | 44-7317 | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb88Sn10Ag2 (88/10/2) | Bar, 1.66 lbs (750g) | - | 514 ~ 570°F (268 ~ 299°C) | - | - | Leaded | - | ||||
 |
NC191SNL500T5C | 175.9000 | |
2 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191SNL500T5C | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | 5 | ||||
 |
SMD2185 | 89.9500 | |
5 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.018" (0.46mm) | 361°F (183°C) | - | - | Leaded | |||||
 |
NC191SNL35 | 18.9500 | |
4 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191SNL35 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
 |
24-6337-9746 | 102.9500 | |
163 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | Leaded | |||||
 |
NC191LTA15 | 10.9500 | |
12 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA15 | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Syringe, 0.53 oz (15g), 5cc | - | 279°F (137°C) | No-Clean | - | - | 4 | ||||
 |
70-0202-0519 | - | |
9990 | 0.00000000 | Kester Solder | EP256HA | Bulk | Active | Solder Paste | 70-0202 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn63Pb37 (63/37) | Cartridge, 24.69 oz (700g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||
|
26-6040-0060 | - | |
1989 | 0.00000000 | Kester Solder | 44 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 5 lbs (2.27kg) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | ||||||
 |
TS391SNL10 | 31.9500 | |
8 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391S | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
 |
14-7080-0125 | - | |
2028 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 14-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 450 ~ 464°F (232 ~ 240°C) | - | 8 AWG, 10 SWG | Lead Free | |||||
 |
SMDSWLT.040 200G | 197.0000 | |
3168 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Spool, 7 oz (200g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | ||||||
 |
SSWS-50G | 23.9900 | |
3377 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSWS | 12 Months | Date of Manufacture | 37°F ~ 42°F (3°C ~ 6°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-SSWS-50G | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | - | - | Water Soluble | - | - | 3 | ||||
|
16-7050-0062 | 506.4240 | |
9116 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 16-7050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 5 lbs (2.27kg) | 0.062" (1.57mm) | 430 ~ 444°F (221 ~ 223°C) | - | 14 AWG, 16 SWG | Lead Free | |||||
 |
24-6337-6417 | 64.5800 | |
50 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 361°F (183°C) | Water Soluble | 22 AWG, 23 SWG | Leaded | ||||
 |
SMDSWLF.015 1OZ | 11.6300 | |
5 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | ||||
 |
SMD3SW.031 2OZ | 19.6400 | |
1 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | ||||
|
WBAR62/36/2 | 51.9900 | |
8274 | 0.00000000 | SRA Soldering Products | SUPER-PURE™ | Bag | Active | Bar Solder | WBAR62/36 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 2260-WBAR62/36/2 | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Bar, 1 lb (453.59g) | - | - | - | - | Leaded | |||||
 |
SR37-LFM48S-3.5-0.8MM | 48.3100 | |
5 | 0.00000000 | Almit | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | - | - | ROHS3 Compliant | 1 (Unlimited) | 2345-SR37-LFM48S-3.5-0.8MM | EAR99 | 8311.30.6000 | 1 | - | Spool, 3.53 oz (100g) | 0.031" (0.79mm) | - | - | - | Lead Free | |||||||
 |
SMDLTLFP250T5 | 132.9500 | |
2687 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMDLTL | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 5 | |||
 |
RCBLF22701031P | 58.9200 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF22701031P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 440°F (227°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||||
 |
4917-227G | - | |
6219 | 0.00000000 | MG Chemicals | 4917 | Spool | Obsolete | Wire Solder | - | - | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1240 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | ||||||
 |
24-0015-0017 | - | |
1349 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-0015 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb97.5Ag1.5Sn1 (97.5/1.5/1) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 588°F (309°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Leaded | |||||
 |
NC191SNL50 | 13.9500 | |
13 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191SNL50 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
|
143726 | 49.7500 | |
3612 | 0.00000000 | Kester Solder | ALPHA® | Box | Active | Solder Paste | 6 Months | Date of Manufacture | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 117-143726 | EAR99 | 3810.10.0000 | 100 | - | Refrigerated | |||||||||||
|
14-6337-0010 | - | |
9190 | 0.00000000 | Kester Solder | - | Bulk | Active | Wire Solder | 14-6337 | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 100 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.010" (0.25mm) | 361°F (183°C) | - | 30 AWG, 33 SWG | Leaded | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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